South Korea’s leading electronic parts supplier Samsung Electro-mechanics Co. hopes for "meaningful" growth in sales across its manufacturing bases in Korea, Tianjin, China, and the Philippines as it expands output of mainstay multi-layer ceramic capacitors (MLCC) and begins employment of next-generation panel level packaging (PLP) technology.
"Despite challenges last year due to intensified competition in the smartphone market, we achieved 20 percent growth. We expect to make a leap this year through PLP landscape and reinforced global manufacturing network," said chief executive Lee Yoon-tae on the sidelines of the CES 2017 event held in Las Vegas in the U.S.
MLCC and PLP are crucial in the manufacturing of display panels. MLCC that ensures highly stable power supply also supports electronics going into automobiles. The company will target automobile electronics as electronics have become crucial to motor vehicles in the age of automated and electric cars.
MLCC makes up about a third of the components in a typical circuit module and is applied in production of consumer electronics, phones, video cameras, and general electric circuits.
It plans to up production of dual cameras that can be applied in self-driving vehicles.
PLC is cutting-edge chip packaging technology that can significantly reduce thickness as it does not require substrate to support thinner panels.
By Song Sung-hoon
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