SK Hynix Inc. began mass production of 8GB (Gigabytes) LPDDR4X (low power, double data rate 4X) mobile dynamic random access memory (DRAM) chip package to power high-performance and battery-saving premium smartphones.
The company stacked four 16 Gb(Gigabits) LPDDR4 memory chips - 8Gb is equivalent to 1GB - for 8GB DRAM package. 8GB the highest density in the LPDDR4X standard, which has 20 percent of superiority in power efficiency to current LPDDR4, the company claimed.
Using 8GB LPDDR4X, data I/Os (inputs/outputs) may run at ultra-low voltage of 0.6V leading to better power efficiency. About 34.1GB of data can be processed per second with 64-bit I/Os. The package size is made smaller by more than 30 percent from 8GB LPDDR4 to be small as - 12mm (millimeters) * 12.7 mm - and thinner than 1mm.
“SK Hynix would help mobile device users maximize their experiences” said senior vice president Oh Jong-hoon, the Head of DRAM Product Development Division. The chips also can power high-performance laptops and automotive electronics.
SK Hynix will pair its latest 8GB DRAM package with its upcoming flagship smartphones.
By Lee Dong-in
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