Samsung Elec mass-produces 10-nm mobile AP chips

2017.02.23 16:48:42 | 2017.02.23 16:49:02
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Samsung Electronics Co. said Thursday it has begun to roll out from its 10-nanometer FinFET processing lines an enhanced mobile application processor (AP) embedded with a gigabit LTE modem and comprising all of the chipmaker’s leading edges to power upcoming Galaxy S8 premium phone.

The electronics giant announced mass-production in the premium AP, the Exynos 9 Series 8895. This is its first processor chipset produced using its so-called 10-nanometer FinFet process technology, which Samsung had pioneered last October that allows up to 27 percent higher performance while consuming 40 percent less power when compared to 14nm technology, the company claimed.

10 nm refers to the 10 of one billion-thick meter semiconductor circuit. FinFET is the technology, which quickens the speed of information process by making semiconductor device third-dimension structure.

The new Exynos 9 Series 8895 is embedded with a giga bit long term evolution (LTE) modem that supports five carrier aggregation, or 5CA that promises of up to 1 Giga bit per second (Gbps) downlink with 5CA and 150 Mega bit per second (Mbps) uplink using two-carrier aggregation.

The new octa-core AP has its self-developed 64-bit central processing unit (CPU) and British chip designing firm ARM Holdings Plc’s Mali-G71 graphic processing unit (GPU) to process ultra high definition (UHD) and virtual reality (VR) videos.

Samsung applied its Coherent Interconnect (SCI) technology to allow the CPU and GPU to use the same architecture to be interconnected which in turn would be used for artificial intelligence (AI) and deep learning.

The chip comes with multi-format codec (MFC) to support video filming and playing at maximum resolution of 4K UHD at 120 frames per second (fps).

The new AP also has a separate process unit designed to handle security applications such as mobile payments for iris and fingerprint scanning and vision processing unit (VPU) for enhanced vision.

“In addition to being built on the most advanced 10nm FinFET process technology, the new Exynos 9 Series 8895 incorporates Samsung’s cutting-edge technologies including a 2nd generation custom CPU, gigabit LTE modem, and more” said Ben Hur, Vice President of System LSI marketing at Samsung Electronics. “With industry leading technologies like VPU, the Exynos 8895 will drive the innovation of next generation smartphones, VR headsets, and automotive infotainment system.”

The chips will be fitted onto upcoming Galaxy S8 and premium Samsung mobile devices.

By Song Sung-hoon

[ⓒ Pulse by Maeil Business News Korea & mk.co.kr, All rights reserved]

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